AGFB027R31C3I3EC
2692760-Cell, PBGA3184Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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The Intel AGFB027R31C3I3EC is a high-performance FPGA SOC from the AGFB027 series. This component features 2,692,760 logic cells and an organization of 91,280 CLBs, providing significant computational capacity. It offers 720 input and 720 output terminals within a 3184-ball PBGA package conforming to R-PBGA-B3184 specifications. The device operates across a temperature range of -40°C to 100°C and is designed for surface mounting with a terminal pitch of 0.920mm. Its rectangular grid array package style, with a body length of 56.00mm and width of 45.00mm, accommodates its advanced functionality. This FPGA SOC is suitable for demanding applications in sectors such as telecommunications, data processing, and industrial automation.
Additional Information
Series: AGFB027RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 45.0000 |
| Length | 56.0000 |
| JESD_30_Code | R-PBGA-B3184 |
| Number_of_CLBs | 91280 |
| Number_of_Inputs | 720 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 720 |
| Number_of_Terminals | 3184 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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