AGFB027R31C2I3EC
2692760-Cell, PBGA3184Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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The Intel AGFB027R31C2I3EC is a high-density FPGA SOC featuring 2,692,760 logic cells. This component, part of the AGFB027 series, is housed in an R-PBGA-B3184 package with 3184 terminals and a 0.920mm terminal pitch. It offers 91280 CLBs, each configurable for complex logic functions, with 720 input and 720 output connections. The device operates within a temperature range of -40°C to 100°C and is designed for surface mounting. Applications for this Intel FPGA include advanced telecommunications infrastructure, high-performance computing, and complex industrial automation systems. Its substantial cell count and robust I/O capabilities support demanding digital signal processing and control applications.
Additional Information
Series: AGFB027RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 45.0000 |
| Length | 56.0000 |
| JESD_30_Code | R-PBGA-B3184 |
| Number_of_CLBs | 91280 |
| Number_of_Inputs | 720 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 720 |
| Number_of_Terminals | 3184 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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