AGFB027R31C2I1VC
2692760-Cell, PBGA3184Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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The Intel AGFB027R31C2I1VC is a high-density FPGA SOC from the AGFB027 series. This component features 2,692,760 logic cells, organized as 91,280 CLBs. It offers 720 input and 720 output terminals, integrated within a 3184-ball Plastic Ball Grid Array (PBGA) package. The device operates across a temperature range of -40°C to 100°C and utilizes a 0.920mm terminal pitch. Its rectangular grid array package style, with a seated height maximum of 3.6760mm, is suitable for surface-mount applications. This component is employed in demanding applications within the telecommunications, data center, and high-performance computing industries.
Additional Information
Series: AGFB027RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 45.0000 |
| Length | 56.0000 |
| JESD_30_Code | R-PBGA-B3184 |
| Number_of_CLBs | 91280 |
| Number_of_Inputs | 720 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 720 |
| Number_of_Terminals | 3184 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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