AGFB027R24C3I3EC
2692760-Cell, PBGA2340Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB027R24C3I3EC is a high-performance Field Programmable Gate Array (FPGA) within the AGFB027 series. This device features 2,692,760 logic cells and is organized into 91,280 CLBs, providing substantial capacity for complex digital designs. It offers 744 inputs and 744 outputs, supported by a 2340-terminal PBGA2340 package. The component operates within a temperature range of -40°C to 100°C and is designed for surface mounting with a terminal pitch of 0.920mm. Its rectangular grid array package is constructed from plastic/epoxy. This FPGA SOC is utilized in demanding applications across various industries, including telecommunications, data centers, and high-performance computing.
Additional Information
Series: AGFB027RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 42.0000 |
| Length | 45.0000 |
| JESD_30_Code | R-PBGA-B2340 |
| Number_of_CLBs | 91280 |
| Number_of_Inputs | 744 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 744 |
| Number_of_Terminals | 2340 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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