AGFB027R24C2I1VC
2692760-Cell, PBGA2340Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB027R24C2I1VC is a high-density FPGA SoC from the AGFB027 series. This component features 2,692,760 logic cells organized into 91,280 CLBs, offering substantial capacity for complex digital designs. It includes 744 input and 744 output terminals, supported by a 2340-terminal PBGA2340 package with a 0.920mm pitch. The device operates within a temperature range of -40°C to 100°C. Its applications span high-performance computing, data center acceleration, and advanced networking infrastructure. The rectangular grid array package is constructed from plastic/epoxy and designed for surface mounting.
Additional Information
Series: AGFB027RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 42.0000 |
| Length | 45.0000 |
| JESD_30_Code | R-PBGA-B2340 |
| Number_of_CLBs | 91280 |
| Number_of_Inputs | 744 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 744 |
| Number_of_Terminals | 2340 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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