AGFB027R24C2E3EC
2692760-Cell, PBGA2340Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB027R24C2E3EC is a high-density FPGA SOC from the AGFB027 series. This component features 2,692,760 logic cells, organized as 91,280 CLBs, offering extensive logic capacity for complex designs. It provides 744 input and 744 output terminals, enabling robust connectivity. The device is housed in a 2340-terminal R-PBGA package with a ball terminal form and a 0.920mm pitch, measuring 45.00mm by 42.00mm with a maximum seated height of 3.6760mm. Operating within a temperature range of 0°C to 100°C, this surface-mount component is suitable for demanding applications in sectors such as telecommunications, data center infrastructure, and high-performance computing.
Additional Information
Series: AGFB027RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 42.0000 |
| Length | 45.0000 |
| JESD_30_Code | R-PBGA-B2340 |
| Number_of_CLBs | 91280 |
| Number_of_Inputs | 744 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 744 |
| Number_of_Terminals | 2340 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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