AGFB027R24C2E2VC
2692760-Cell, PBGA2340Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB027R24C2E2VC is a high-performance FPGA SOC featuring 2,692,760 logic cells and an organization of 91,280 CLBs. This component utilizes a R-PBGA-B2340 package with 2340 terminals arranged in a bottom-mounted ball grid array. The rectangular package measures 45.0000 mm in length and 42.0000 mm in width, with a terminal pitch of 0.920 mm and a maximum seated height of 3.6760 mm. Operating within a temperature range of 0.0°C to 100.0°C, this surface-mount device is suitable for demanding applications in aerospace, defense, and high-performance computing.
Additional Information
Series: AGFB027RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 42.0000 |
| Length | 45.0000 |
| JESD_30_Code | R-PBGA-B2340 |
| Number_of_CLBs | 91280 |
| Number_of_Inputs | 744 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 744 |
| Number_of_Terminals | 2340 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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