AGFB027R24C1I2VB
2692760-Cell, PBGA2340Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB027R24C1I2VB is a high-performance FPGA SoC from the AGFB027 series. This component features 2,692,760 logic cells and an organization of 91,280 CLBs, providing substantial capacity for complex digital designs. It offers 744 input and 744 output connections, supported by a total of 2340 terminals arranged in a rectangular PBGA2340 (R-PBGA-B2340) package. The device operates within a temperature range of -40.0°C to 100.0°C, utilizing a 0.920mm terminal pitch for its bottom-mounted ball terminals. This surface-mount component, with a plastic/epoxy package body material, is suitable for applications in telecommunications, data processing, and high-performance computing.
Additional Information
Series: AGFB027RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 42.0000 |
| Length | 45.0000 |
| JESD_30_Code | R-PBGA-B2340 |
| Number_of_CLBs | 91280 |
| Number_of_Inputs | 744 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 744 |
| Number_of_Terminals | 2340 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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