AGFB027R24B3E4F
2692760-Cell, PBGA2486Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB027R24B3E4F, a member of the AGFB027 series, is a 2,692,760-logic-cell Field Programmable Gate Array (FPGA) featuring FinFET technology. This device offers 768 inputs and 768 outputs, with a substantial 2486-terminal PBGA package (R-PBGA-B2486) characterized by a 1.00 mm terminal pitch. Operating within a 0.0 V to 100.0 °C temperature range, it utilizes a nominal supply voltage of 0.8 V. The organization is specified as 91,280 CLBs. Its rectangular grid array package is designed for surface mounting and has dimensions of 55.00 mm x 42.50 mm with a maximum seated height of 3.6960 mm. This component is utilized in demanding applications across telecommunications, data center infrastructure, and high-performance computing.
Additional Information
Series: AGFB027RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 55.0000 |
| Width | 42.5000 |
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B2486 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 2486 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6960 |
| Supply_Voltage_Max | 0.82400 |
| Supply_Voltage_Min | 0.77600 |
| Supply_Voltage_Nom | 0.8 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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