AGFB027R24B3E3V
2692760-Cell, PBGA2486Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB027R24B3E3V is a high-density Field Programmable Gate Array (FPGA) featuring 2,692,760 logic cells. This device utilizes FINFET technology and is housed in a 2486-ball Plastic Ball Grid Array (PBGA) package, conforming to R-PBGA-B2486 standards. Measuring 55.00 x 42.50 mm with a maximum seated height of 3.6960 mm, it offers 768 input and 768 output terminals with a 1.000 mm pitch. The operating supply voltage ranges from 0.664V to 0.706V, with a nominal value of 0.685V. Its organization includes 91,280 CLBs and it operates within a temperature range of 0°C to 100°C. This component is suitable for demanding applications in telecommunications, high-performance computing, and data center infrastructure.
Additional Information
Series: AGFB027RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 42.5000 |
| Technology | FinFET |
| Length | 55.0000 |
| JESD_30_Code | R-PBGA-B2486 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 2486 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6960 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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