AGFB027R24B3E1V
2692760-Cell, PBGA2486Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB027R24B3E1V is a high-density Field Programmable Gate Array (FPGA) featuring 2,692,760 logic cells and an organization of 91,280 CLBs. This device utilizes advanced FINFET technology and operates within a supply voltage range of 0.664V to 0.706V, with a nominal voltage of 0.685V. The component is housed in a 2486-terminal PBGA (Plastic Ball Grid Array) package, a rectangular grid array style with a terminal pitch of 1.000mm. Designed for surface mounting, it offers 768 inputs and 768 outputs. The operating temperature range is from 0.0°C to 100.0°C. This FPGA is suitable for demanding applications in sectors such as data center acceleration, high-performance computing, and advanced networking infrastructure.
Additional Information
Series: AGFB027RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 55.0000 |
| Width | 42.5000 |
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B2486 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 2486 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6960 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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