AGFB027R24B1E3V
2692760-Cell, PBGA2486Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB027R24B1E3V is a high-density Field Programmable Gate Array (FPGA) from the AGFB027 series, featuring 2,692,760 logic cells. This device utilizes advanced FINFET technology and is housed in a 2486-terminal R-PBGA (Rectangular Plastic Ball Grid Array) package with a 1.000mm terminal pitch. It offers 768 inputs and 768 outputs, with an organization of 91,280 CLBs (Configurable Logic Blocks). The operating temperature range is 0.0°C to 100.0°C, and it operates with a nominal supply voltage of 0.685V, with a maximum of 0.706V and minimum of 0.664V. This FPGA is designed for high-performance applications in sectors such as telecommunications, data center infrastructure, and high-performance computing.
Additional Information
Series: AGFB027RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 42.5000 |
| Technology | FinFET |
| Length | 55.0000 |
| JESD_30_Code | R-PBGA-B2486 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 2486 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6960 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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