AGFB022R33A3E3V
2208075-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB022R33A3E3V is a Field Programmable Gate Array (FPGA) SOC from the AGFB022 series. This device features 2,208,075 logic cells organized as 74,850 CLBs, with 768 input and 768 output pins. The component utilizes FINFET technology and operates within a temperature range of 0°C to 100°C. It is housed in a 3343-terminal R-PBGA package with a rectangular shape and bottom-mounted ball terminals, suitable for surface mounting. The nominal supply voltage is 0.685V, with a range of 0.664V to 0.706V. This component finds application in industries such as telecommunications, data center acceleration, and high-performance computing.
Additional Information
Series: AGFB022RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B3343 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2208075 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 3343 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 74850 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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