AGFB022R33A2I3E
2208075-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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The Intel AGFB022R33A2I3E is a field-programmable gate array (FPGA) SOC belonging to the AGFB022 series. This component features 2,208,075 logic cells and an organization of 74,850 CLBs. It offers 768 inputs and 768 outputs, with a total of 3343 terminals arranged in a ball grid array (R-PBGA-B3343) package. Operating within a temperature range of -40°C to 100°C, this FINFET technology-based device utilizes a plastic/epoxy rectangular package with bottom-positioned balls for surface mounting. The nominal supply voltage is 0.685V, with a range of 0.664V to 0.706V. This FPGA SOC is suitable for applications in high-performance computing, data center infrastructure, and advanced networking.
Additional Information
Series: AGFB022RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B3343 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2208075 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 3343 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 74850 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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