AGFB022R31C3E4XC
2208075-Cell, PBGA3184Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB022R31C3E4XC is a high-performance FPGA SOC from the AGFB022 series. This component features 2,208,075 logic cells and an organization of 74,850 CLBs, providing substantial capacity for complex logic designs. It offers 720 input and 720 output terminals, facilitating extensive connectivity. The device is housed in a 3184-terminal R-PBGA-B3184 package, a rectangular grid array with a 0.920mm terminal pitch. Operating within a temperature range of 0°C to 100°C, this surface-mount component is suitable for applications in telecommunications, data center acceleration, and high-performance computing. The plastic/epoxy package ensures robust environmental protection.
Additional Information
Series: AGFB022RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 56.0000 |
| Width | 45.0000 |
| JESD_30_Code | R-PBGA-B3184 |
| Number_of_CLBs | 74850 |
| Number_of_Inputs | 720 |
| Number_of_Logic_Cells | 2208075 |
| Number_of_Outputs | 720 |
| Number_of_Terminals | 3184 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 74850 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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