AGFB022R31C3E3EC
2208075-Cell, PBGA3184Manufacturer: Intel
Categories: Field Programmable Gate Arrays
Quality Control: Learn More
Intel AGFB022R31C3E3EC is a high-performance FPGA SoC from the AGFB022 series. This component features 2,208,075 logic cells organized as 74,850 CLBs, supporting a substantial number of inputs and outputs at 720 each. It is housed in a 3184-terminal R-PBGA package with a rectangular shape and bottom-mounted ball terminals on a 0.920mm pitch. The package body is constructed from plastic/epoxy and measures 56.0000mm in length and 45.0000mm in width, with a maximum seated height of 3.6760mm. Operating within a temperature range of 0.0°C to 100.0°C, this surface-mount device is designed for demanding applications in areas such as data center acceleration, high-performance computing, and advanced networking infrastructure.
Additional Information
Series: AGFB022RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 45.0000 |
| Length | 56.0000 |
| JESD_30_Code | R-PBGA-B3184 |
| Number_of_CLBs | 74850 |
| Number_of_Inputs | 720 |
| Number_of_Logic_Cells | 2208075 |
| Number_of_Outputs | 720 |
| Number_of_Terminals | 3184 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 74850 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
Request a Quote
Clients Also Buy
AGFB022R24C2E3VC
2208075-Cell, PBGA2340
AGFB022R24C2I1VC
2208075-Cell, PBGA2340
AGFB022R31C2E2VC
2208075-Cell, PBGA3184