AGFB022R31C2I3VC
2208075-Cell, PBGA3184Manufacturer: Intel
Categories: Field Programmable Gate Arrays
Quality Control: Learn More
Intel AGFB022R31C2I3VC is a high-performance FPGA SOC from the AGFB022 series, featuring 2,208,075 logic cells and an organization of 74,850 CLBs. This component is housed in a 3184-terminal, R-PBGA-B3184 package, a rectangular grid array with a terminal pitch of 0.920mm. Operating within a temperature range of -40°C to 100°C, it offers 720 inputs and 720 outputs, facilitating complex signal routing. Its plastic/epoxy package material and surface-mount capability make it suitable for demanding applications in aerospace, defense, and high-performance computing where advanced processing and reconfigurability are essential.
Additional Information
Series: AGFB022RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 45.0000 |
| Length | 56.0000 |
| JESD_30_Code | R-PBGA-B3184 |
| Number_of_CLBs | 74850 |
| Number_of_Inputs | 720 |
| Number_of_Logic_Cells | 2208075 |
| Number_of_Outputs | 720 |
| Number_of_Terminals | 3184 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 74850 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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