AGFB022R24C3E3EC
2208075-Cell, PBGA2340Manufacturer: Intel
Categories: Field Programmable Gate Arrays
Quality Control: Learn More
Intel AGFB022R24C3E3EC is a high-performance FPGA SOC from the AGFB022 series. This component features 2,208,075 logic cells and is organized into 74,850 CLBs, providing extensive logic capacity. It offers 744 inputs and 744 outputs, facilitating complex signal routing. The device is housed in a 2340-terminal, R-PBGA-B2340 package with a rectangular body shape and a grid array style. The package features bottom-positioned ball terminals with a pitch of 0.920mm. Operating within a temperature range of 0°C to 100°C, this surface-mount component is suitable for demanding applications in areas such as telecommunications, data center infrastructure, and high-performance computing. The package dimensions are 45.0000mm in length and 42.0000mm in width, with a maximum seated height of 3.6760mm.
Additional Information
Series: AGFB022RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 42.0000 |
| Length | 45.0000 |
| JESD_30_Code | R-PBGA-B2340 |
| Number_of_CLBs | 74850 |
| Number_of_Inputs | 744 |
| Number_of_Logic_Cells | 2208075 |
| Number_of_Outputs | 744 |
| Number_of_Terminals | 2340 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 74850 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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