AGFB022R24C2E3VC
2208075-Cell, PBGA2340Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB022R24C2E3VC is an FPGA SOC from the AGFB022 series, featuring 2,208,075 logic cells and an organization of 74,850 CLBs. This device is housed in a 2340-terminal R-PBGA package with a rectangular shape, Ball Grid Array (BGA) style, and a terminal pitch of 0.920mm. The package body material is plastic/epoxy, and it supports surface mounting with bottom terminal positions. With 744 inputs and 744 outputs, this component is designed for demanding applications across various industries including telecommunications, data processing, and high-performance computing. Operating temperature ranges from 0.0°C to 100.0°C.
Additional Information
Series: AGFB022RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 42.0000 |
| Length | 45.0000 |
| JESD_30_Code | R-PBGA-B2340 |
| Number_of_CLBs | 74850 |
| Number_of_Inputs | 744 |
| Number_of_Logic_Cells | 2208075 |
| Number_of_Outputs | 744 |
| Number_of_Terminals | 2340 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 74850 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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