AGFB022R24B1I3E
2208075-Cell, PBGA2486Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB022R24B1I3E is a high-performance FPGA SoC featuring 2,208,075 logic cells and a FINFET technology. This component is housed in a 2486-terminal R-PBGA package with a 1.000 mm terminal pitch and a rectangular grid array form factor. It supports a wide operating temperature range from -40°C to +100°C and operates at a nominal supply voltage of 0.685V, with a minimum of 0.664V and a maximum of 0.706V. The device offers 768 inputs and 768 outputs. Applications for this component can be found in demanding sectors such as telecommunications, data center acceleration, and high-performance computing.
Additional Information
Series: AGFB022RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 42.5000 |
| Technology | FinFET |
| Length | 55.0000 |
| JESD_30_Code | R-PBGA-B2486 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2208075 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 2486 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 74850 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6960 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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