AGFB022R24B1I1V
2208075-Cell, PBGA2486Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB022R24B1I1V is an FPGA SOC component from the AGFB022 series. This device features 2,208,075 logic cells and is housed in a 2486-terminal R-PBGA-B2486 package, a rectangular grid array with a 1.000mm terminal pitch. Operating within a temperature range of -40°C to 100°C, it supports a nominal supply voltage of 0.685V, with a maximum of 0.706V and a minimum of 0.664V. The technology employed is FINFET, offering advanced performance characteristics. This surface-mount component is suitable for demanding applications in data center infrastructure, networking, and high-performance computing. The package dimensions are 55.00mm in length and 42.50mm in width, with a maximum seated height of 3.6960mm. The organization comprises 74,850 CLBs.
Additional Information
Series: AGFB022RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 42.5000 |
| Technology | FinFET |
| Length | 55.0000 |
| JESD_30_Code | R-PBGA-B2486 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2208075 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 2486 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 74850 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6960 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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