AGFB022R24B1E2V
2208075-Cell, PBGA2486Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB022R24B1E2V is a high-density FPGA SOC component from the AGFB022 series. This device features 2,208,075 logic cells and an organization of 74,850 CLBs, supported by 768 input and 768 output terminals. Built on FINFET technology, it operates within a temperature range of 0.0°C to 100.0°C. The component is housed in a rectangular R-PBGA-B2486 package with a 1.000mm terminal pitch, measuring 55.0000mm in length and 42.5000mm in width, with a maximum seated height of 3.6960mm. It utilizes a low core supply voltage, nominal at 0.685V with a range of 0.664V to 0.706V. Applications for this component include advanced computing, data center infrastructure, and high-performance networking.
Additional Information
Series: AGFB022RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 55.0000 |
| Width | 42.5000 |
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B2486 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2208075 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 2486 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 74850 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6960 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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