AGFB019R31C2E3V
1.918975e+06-Cell, PBGA3184Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB019R31C2E3V is a high-performance Field Programmable Gate Array (FPGA) from the AGFB019 series. This device features 1,918,975 logic cells, organized into 65,050 Configurable Logic Blocks (CLBs), and offers 480 input and 480 output terminals. It is housed in a 3184-terminal, rectangular PBGA (Plastic Ball Grid Array) package with a 0.920 mm terminal pitch. The component is designed for surface mounting and operates within a temperature range of 0°C to 100°C. Its robust architecture makes it suitable for demanding applications in the telecommunications, data center, and industrial automation sectors.
Additional Information
Series: AGFB019RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 45.0000 |
| Length | 56.0000 |
| JESD_30_Code | R-PBGA-B3184 |
| Number_of_CLBs | 65050 |
| Number_of_Inputs | 480 |
| Number_of_Logic_Cells | 1918975 |
| Number_of_Outputs | 480 |
| Number_of_Terminals | 3184 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 65050 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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