AGFB014R24D2E3VC
1437240-Cell, PBGA2340Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB014R24D2E3VC is a high-density FPGA SoC from the AGFB014 series. This device features 1,437,240 logic cells and an organization of 48,720 CLBs, providing substantial capacity for complex digital designs. It offers 744 dedicated input and output terminals within a 2340-terminal R-PBGA-B2340 package. The component operates within a temperature range of 0.0°C to 100.0°C and is designed for surface mounting. Its rectangular grid array package has a terminal pitch of 0.920mm. Applications for this level of performance can be found in high-performance computing, telecommunications infrastructure, and advanced aerospace and defense systems.
Additional Information
Series: AGFB014RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 42.0000 |
| Length | 45.0000 |
| JESD_30_Code | R-PBGA-B2340 |
| Number_of_CLBs | 48720 |
| Number_of_Inputs | 744 |
| Number_of_Logic_Cells | 1437240 |
| Number_of_Outputs | 744 |
| Number_of_Terminals | 2340 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 48720 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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