AGFB014R24D2E2VC
1437240-Cell, PBGA2340Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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The Intel AGFB014R24D2E2VC is a high-density programmable logic device featuring 1,437,240 logic cells organized as 48,720 CLBs. This FPGA SoC, part of the AGFB014 series, is housed in a R-PBGA-B2340 package measuring 45.00 mm x 42.00 mm with a terminal pitch of 0.920 mm. It offers 744 input and 744 output terminals, presented in a ball grid array (BGA) configuration. Operating within a temperature range of 0.0°C to 100.0°C, this component is designed for surface mounting and is suitable for demanding applications in the aerospace, defense, and high-performance computing industries.
Additional Information
Series: AGFB014RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 42.0000 |
| Length | 45.0000 |
| JESD_30_Code | R-PBGA-B2340 |
| Number_of_CLBs | 48720 |
| Number_of_Inputs | 744 |
| Number_of_Logic_Cells | 1437240 |
| Number_of_Outputs | 744 |
| Number_of_Terminals | 2340 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 48720 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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