AGFB014R24C3I3EC
1437240-Cell, PBGA2340Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB014R24C3I3EC is a high-performance FPGA SoC featuring 1,437,240 logic cells organized into 48,720 CLBs. This device supports 744 inputs and 744 outputs within a 2340-ball PBGA (R-PBGA-B2340) package. The rectangular package measures 45.0000mm in length and 42.0000mm in width, with a terminal pitch of 0.920mm. Operating across a temperature range of -40°C to 100°C, this plastic/epoxy molded component is designed for surface-mount applications. Its organization as a grid array with bottom ball terminals makes it suitable for demanding applications in telecommunications, data processing, and high-performance computing.
Additional Information
Series: AGFB014RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 42.0000 |
| Length | 45.0000 |
| JESD_30_Code | R-PBGA-B2340 |
| Number_of_CLBs | 48720 |
| Number_of_Inputs | 744 |
| Number_of_Logic_Cells | 1437240 |
| Number_of_Outputs | 744 |
| Number_of_Terminals | 2340 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 48720 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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