AGFB014R24C2E3EC
1437240-Cell, PBGA2340Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB014R24C2E3EC is a high-performance Intel FPGA SoC. This component features 1,437,240 logic cells, organized into 48,720 CLBs. It offers 744 input and 744 output pins, with a total of 2340 terminals within a rectangular R-PBGA-B2340 package. The device operates within a temperature range of 0°C to 100°C and is designed for surface mounting with a terminal pitch of 0.920 mm. Its plastic/epoxy package has a body length of 45.0000 mm and a width of 42.0000 mm, with a maximum seated height of 3.6760 mm. This FPGA is utilized in demanding applications across various industries, including telecommunications, data center acceleration, and high-performance computing.
Additional Information
Series: AGFB014RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 42.0000 |
| Length | 45.0000 |
| JESD_30_Code | R-PBGA-B2340 |
| Number_of_CLBs | 48720 |
| Number_of_Inputs | 744 |
| Number_of_Logic_Cells | 1437240 |
| Number_of_Outputs | 744 |
| Number_of_Terminals | 2340 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 48720 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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