AGFB014R19A1I2V
1437240-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB014R19A1I2V is a high-density FPGA SOC featuring 1,437,240 logic cells organized into 48,720 CLBs. This FinFET technology device operates within a temperature range of -40°C to 100°C, with a nominal supply voltage of 0.685V. The R-PBGA-B1957 package is rectangular, plastic/epoxy, and employs a ball terminal form factor on the bottom, providing 1957 terminals for extensive connectivity. With 576 inputs and 576 outputs, this component is suitable for demanding applications in areas such as data center acceleration, high-performance computing, and advanced networking infrastructure.
Additional Information
Series: AGFB014RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_CLBs | 48720 |
| Number_of_Inputs | 576 |
| Number_of_Logic_Cells | 1437240 |
| Number_of_Outputs | 576 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 48720 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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