AGFB012R24D2E3VC
1178525-Cell, PBGA2340Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB012R24D2E3VC is a high-density FPGA SOC featuring 1,178,525 logic cells and 39,950 CLBs. This device utilizes a PBGA2340 package with a rectangular grid array footprint, measuring 45.00mm by 42.00mm with a seated height of 3.6760mm. It offers 744 input and 744 output terminals with a ball terminal form and a 0.920mm pitch. The component operates within a temperature range of 0.0°C to 100.0°C and is constructed with plastic/epoxy packaging. This FPGA SOC is suitable for demanding applications in the communications, data center, and high-performance computing industries.
Additional Information
Series: AGFB012RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 45.0000 |
| Width | 42.0000 |
| JESD_30_Code | R-PBGA-B2340 |
| Number_of_CLBs | 39950 |
| Number_of_Inputs | 744 |
| Number_of_Logic_Cells | 1178525 |
| Number_of_Outputs | 744 |
| Number_of_Terminals | 2340 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 39950 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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