AGFB012R24C3E4XC
1178525-Cell, PBGA2340Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB012R24C3E4XC is a high-density FPGA SOC from the AGFB012 series. This component features 1,178,525 logic cells and an organization of 39,950 CLBs, providing extensive capacity for complex digital designs. It offers 744 inputs and 744 outputs, supported by 2340 terminals arranged in a 0.920mm pitch R-PBGA-B2340 package. The device operates within a temperature range of 0.0°C to 100.0°C. Its rectangular plastic/epoxy package has dimensions of 45.0000mm by 42.0000mm with a maximum seated height of 3.6760mm. This surface-mount component is suitable for demanding applications in sectors such as telecommunications, data center acceleration, and high-performance computing.
Additional Information
Series: AGFB012RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 42.0000 |
| Length | 45.0000 |
| JESD_30_Code | R-PBGA-B2340 |
| Number_of_CLBs | 39950 |
| Number_of_Inputs | 744 |
| Number_of_Logic_Cells | 1178525 |
| Number_of_Outputs | 744 |
| Number_of_Terminals | 2340 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 39950 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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