AGFB012R24C2E2VC
1178525-Cell, PBGA2340Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB012R24C2E2VC is a Field Programmable Gate Array (FPGA) SOC from the AGFB012 series. This component features 1,178,525 logic cells and an organization of 39,950 CLBs, supporting 744 inputs and 744 outputs. It is housed in a 2340-terminal, rectangular PBGA2340 package (R-PBGA-B2340) with a ball terminal form and a 0.920 mm pitch. The package body is constructed from plastic/epoxy with a maximum seated height of 3.6760 mm. This surface-mount device operates within a temperature range of 0.0°C to 100.0°C. Applications for this high-density FPGA can be found in data centers, networking infrastructure, and artificial intelligence acceleration.
Additional Information
Series: AGFB012RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 42.0000 |
| Length | 45.0000 |
| JESD_30_Code | R-PBGA-B2340 |
| Number_of_CLBs | 39950 |
| Number_of_Inputs | 744 |
| Number_of_Logic_Cells | 1178525 |
| Number_of_Outputs | 744 |
| Number_of_Terminals | 2340 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 39950 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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