AGFB012R24B3E4F
1178525-Cell, PBGA2486Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB012R24B3E4F is a high-density FPGA SoC from the AGFB012 series, featuring 1,178,525 logic cells organized into 39,950 CLBs. This component utilizes Intel's FINFET technology and operates with a nominal supply voltage of 0.8V, ranging from 0.776V to 0.824V. The device is housed in a 2486-terminal R-PBGA (Rectangular Plastic Ball Grid Array) package with a 1.000mm terminal pitch. Designed for demanding applications, this surface-mount component boasts a rectangular footprint of 55.00mm x 42.50mm and a maximum seated height of 3.696mm. Its operating temperature range is from 0.0°C to 100.0°C. This FPGA is suitable for use in advanced computing, data center infrastructure, and high-performance networking.
Additional Information
Series: AGFB012RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 55.0000 |
| Width | 42.5000 |
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B2486 |
| Number_of_CLBs | 39950 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 1178525 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 2486 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 39950 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6960 |
| Supply_Voltage_Max | 0.82400 |
| Supply_Voltage_Min | 0.77600 |
| Supply_Voltage_Nom | 0.8 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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