AGFB012R24A3I3E
1178525-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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The Intel AGFB012R24A3I3E is a high-density field-programmable gate array (FPGA) featuring 1,178,525 logic cells and 39,950 configurable logic blocks (CLBs). This device utilizes Intel's FINFET technology and operates within a temperature range of -40°C to 100°C. It offers 768 input and 768 output terminals, with a total of 2,486 terminals. The AGFB012R24A3I3E is packaged in a 2486-ball R-PBGA (Rectangular Plastic Ball Grid Array) with a plastic/epoxy body, designed for surface mounting. Its nominal supply voltage is 0.685V, with a range of 0.664V to 0.706V. This component is well-suited for demanding applications in data center acceleration, high-performance computing, and advanced networking infrastructure.
Additional Information
Series: AGFB012RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B2486 |
| Number_of_CLBs | 39950 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 1178525 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 2486 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 39950 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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