AGFB012R19A3I3V
1178525-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB012R19A3I3V is a Field Programmable Gate Array (FPGA) SOC from the AGFB012 series. This component features 1,178,525 logic cells and 39,950 CLBs, with 576 inputs and 576 outputs. It is manufactured using FINFET technology and operates within a temperature range of -40°C to 100°C. The device utilizes a 1957-terminal R-PBGA-B1957 package, a rectangular plastic/epoxy form factor with bottom-mounted ball terminals, designed for surface mounting. The nominal supply voltage is 0.685V, with a range of 0.664V to 0.706V. This component is suitable for applications in high-performance computing, data center infrastructure, and advanced networking.
Additional Information
Series: AGFB012RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_CLBs | 39950 |
| Number_of_Inputs | 576 |
| Number_of_Logic_Cells | 1178525 |
| Number_of_Outputs | 576 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 39950 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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