AGFB012R19A3I2V
1178525-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
Quality Control: Learn More
Intel AGFB012R19A3I2V, a Field Programmable Gate Array (FPGA) SoC utilizing FINFET technology, offers 1,178,525 logic cells organized into 39,950 CLBs. This component features 576 inputs and 576 outputs, with a total of 1957 terminals in a rectangular R-PBGA-B1957 package. Operating within a temperature range of -40°C to 100°C, the AGFB012 series device requires a supply voltage typically around 0.685V, with a minimum of 0.664V and a maximum of 0.706V. Its plastic/epoxy package is designed for surface mounting, and the terminals are ball-shaped, positioned on the bottom. This FPGA SoC is suitable for demanding applications in the communications, data center, and high-performance computing industries.
Additional Information
Series: AGFB012RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_CLBs | 39950 |
| Number_of_Inputs | 576 |
| Number_of_Logic_Cells | 1178525 |
| Number_of_Outputs | 576 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 39950 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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