AGFB012R19A3E4F
1178525-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
Quality Control: Learn More
Intel AGFB012R19A3E4F represents a high-density FPGA SoC from the AGFB012 series. This device features 1178525 logic cells, organized into 39950 CLBs, and supports 576 inputs and 576 outputs. It operates with a nominal supply voltage of 0.8V, ranging from 0.776V to 0.824V. The component utilizes FINFET technology for advanced performance and power efficiency. Packaged in a 1957-terminal R-PBGA (Rectangular Plastic Ball Grid Array) with a plastic/epoxy body, it is designed for surface mounting. The operating temperature range is from 0°C to 100°C. This component is suitable for demanding applications across various industries including telecommunications, data center acceleration, and high-performance computing.
Additional Information
Series: AGFB012RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_CLBs | 39950 |
| Number_of_Inputs | 576 |
| Number_of_Logic_Cells | 1178525 |
| Number_of_Outputs | 576 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 39950 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.82400 |
| Supply_Voltage_Min | 0.77600 |
| Supply_Voltage_Nom | 0.8 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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