AGFB012R19A3E1V
1178525-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
Quality Control: Learn More
The Intel AGFB012R19A3E1V is a high-performance FPGA SoC from the AGFB012 series. This device features 1,178,525 logic cells and an organization of 39,950 CLBs, providing extensive computational resources. It offers 576 inputs and 576 outputs, supporting complex I/O configurations. Operating within a temperature range of 0°C to 100°C, this component utilizes advanced FINFET technology for enhanced efficiency. The component is housed in a 1957-terminal R-PBGA-B1957 package with a plastic/epoxy body material and a rectangular shape. Its supply voltage operates nominally at 0.685V, with a minimum of 0.664V and a maximum of 0.706V. Designed for surface mounting, the device features bottom-mounted ball terminals. This FPGA SoC is suitable for applications in data center infrastructure, high-performance computing, and advanced networking.
Additional Information
Series: AGFB012RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_CLBs | 39950 |
| Number_of_Inputs | 576 |
| Number_of_Logic_Cells | 1178525 |
| Number_of_Outputs | 576 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 39950 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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