AGFB012R19A2I3E
1178525-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB012R19A2I3E is a high-performance FPGA SoC from the AGFB012 series, featuring 1,178,525 logic cells and 39,950 CLBs. This device is built on Intel's advanced FINFET technology, offering exceptional computational density and power efficiency. It operates within a wide temperature range of -40°C to 100°C, making it suitable for demanding environments. The component utilizes a 1957-terminal R-PBGA-B1957 package with ball terminals on the bottom, designed for surface mounting. With a nominal supply voltage of 0.685V, it supports a voltage range of 0.664V to 0.706V. The architecture provides 576 inputs and 576 outputs, enabling complex signal routing and processing. Applications for this component span telecommunications, data center acceleration, and high-performance computing.
Additional Information
Series: AGFB012RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_CLBs | 39950 |
| Number_of_Inputs | 576 |
| Number_of_Logic_Cells | 1178525 |
| Number_of_Outputs | 576 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 39950 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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