AGFB012R19A1E2V
1178525-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
Quality Control: Learn More
Intel AGFB012R19A1E2V is a Field Programmable Gate Array (FPGA SOC) from the AGFB012 series. This component features 1,178,525 logic cells organized into 39,950 CLBs. It offers 576 input and 576 output terminals within a rectangular R-PBGA-B1957 package. The device utilizes FINFET technology and operates on a nominal supply voltage of 0.685V, with a range of 0.664V to 0.706V. It is designed for surface mounting with ball terminals located on the bottom of the plastic/epoxy package. The operating temperature range is from 0.0°C to 100.0°C. This component is suitable for applications in data center acceleration and high-performance computing.
Additional Information
Series: AGFB012RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_CLBs | 39950 |
| Number_of_Inputs | 576 |
| Number_of_Logic_Cells | 1178525 |
| Number_of_Outputs | 576 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 39950 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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