AGFB006R19A1I3E
573480-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB006R19A1I3E is a high-performance FPGA SoC from the AGFB006 series, featuring 573,480 logic cells and 19,440 CLBs. This component utilizes advanced FINFET technology and operates within a temperature range of -40°C to 100°C. It offers 384 inputs and 384 outputs, with 1957 terminals in a rectangular, plastic/epoxy R-PBGA-B1957 package. The device supports a nominal supply voltage of 0.685V, with a minimum of 0.664V and a maximum of 0.706V. Applications for this component are prevalent in telecommunications, data centers, and high-performance computing. The terminals are bottom-mounted ball contacts, indicating surface-mount compatibility.
Additional Information
Series: AGFB006RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 573480 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 19440 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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