AGFB006R19A1I1V
573480-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB006R19A1I1V is a high-performance FPGA SoC featuring 573,480 logic cells and 19,440 CLBs. This device operates within a temperature range of -40°C to +100°C and utilizes FINFET technology for enhanced efficiency. It offers 384 inputs and 384 outputs, with 1957 solder balls arranged in an R-PBGA-B1957 package. The nominal supply voltage is 0.685V, with a range of 0.664V to 0.706V. Applications for this component are found in demanding sectors such as telecommunications, data center infrastructure, and high-performance computing. The rectangular plastic/epoxy package is designed for surface mounting, with bottom-positioned ball terminals.
Additional Information
Series: AGFB006RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 573480 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 19440 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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