AGFB006R19A1E3E
573480-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB006R19A1E3E is a high-performance FPGA SOC featuring 573,480 logic cells and an organization of 19,440 CLBs. This device utilizes FINFET technology for advanced power and performance characteristics. It offers 384 inputs and 384 outputs, with a total of 1957 terminals arranged in a rectangular R-PBGA-B1957 package. Operating within a temperature range of 0°C to 100°C, it requires a nominal supply voltage of 0.685V, with a range of 0.664V to 0.706V. The component is designed for surface mounting and features bottom-positioned ball terminals. This FPGA is suitable for demanding applications in the telecommunications, data center, and high-performance computing industries.
Additional Information
Series: AGFB006RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 573480 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 19440 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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