AGFB006R16A3I2V
573480-Cell, PBGA1681Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB006R16A3I2V is a high-density FPGA SoC from the AGFB006 series. This component features 573,480 logic cells and an organization of 19,440 CLBs, built on Intel's FINFET technology. It is housed in a 1681-ball PBGA package (R-PBGA-B1681) with a terminal pitch of 0.920mm, measuring 37.5mm x 34.0mm with a maximum seated height of 3.676mm. The device supports 384 inputs and 384 outputs, operating within a supply voltage range of 0.664V to 0.706V with a nominal voltage of 0.685V. Its operational temperature range is -40°C to 100°C. This component is suitable for demanding applications in areas such as high-performance computing, data center acceleration, and advanced networking infrastructure.
Additional Information
Series: AGFB006RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 34.0000 |
| Technology | FinFET |
| Length | 37.5000 |
| JESD_30_Code | R-PBGA-B1681 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 573480 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1681 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 19440 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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