AGFB006R16A3E2V
573480-Cell, PBGA1681Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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The Intel AGFB006R16A3E2V is a high-performance FPGA SoC from the AGFB006 series, featuring 573,480 logic cells. This component utilizes advanced FINFET technology and is housed in a 1681-ball, rectangular PBGA package (R-PBGA-B1681) with a 0.920mm terminal pitch. It offers 384 inputs and 384 outputs, with a nominal supply voltage of 0.685V, operating within a temperature range of 0°C to 100°C. Designed for demanding applications, this surface-mount device is suitable for use in sectors such as telecommunications, data center infrastructure, and high-performance computing where significant computational resources and flexibility are required.
Additional Information
Series: AGFB006RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 37.5000 |
| Width | 34.0000 |
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1681 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 573480 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1681 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 19440 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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