AGFB006R16A1I3V
573480-Cell, PBGA1681Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB006R16A1I3V is a Field Programmable Gate Array (FPGA SOC) from the AGFB006 series. This component features 573,480 logic cells and is housed in a 1681-ball Plastic Ball Grid Array (PBGA) package, identified by JESD-30 code R-PBGA-B1681. It operates within a temperature range of -40°C to 100°C and utilizes advanced FINFET technology. The device offers 384 input and 384 output terminals, with a terminal pitch of 0.920 mm. Its organization includes 19,440 CLBs, and it requires a nominal supply voltage of 0.685V, with a range of 0.664V to 0.706V. This FPGA is designed for high-performance applications in sectors such as data center acceleration, artificial intelligence, and high-performance computing. The rectangular package measures 37.500 mm in length and 34.000 mm in width, with a maximum seated height of 3.6760 mm.
Additional Information
Series: AGFB006RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 37.5000 |
| Width | 34.0000 |
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1681 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 573480 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1681 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 19440 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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