AGFB006R16A1E3V
573480-Cell, PBGA1681Manufacturer: Intel
Categories: Field Programmable Gate Arrays
Quality Control: Learn More
Intel AGFB006R16A1E3V is a 573,480-logic-cell FPGA SoC featuring FinFET technology. This component belongs to the AGFB006 series and is housed in a 1681-ball Plastic Ball Grid Array (PBGA) package, R-PBGA-B1681, with a terminal pitch of 0.920 mm. It offers 384 inputs and 384 outputs, with an organization of 19,440 Configurable Logic Blocks (CLBs). The operating temperature range is 0.0°C to 100.0°C, with a nominal supply voltage of 0.685V, ranging from 0.664V to 0.706V. This surface-mount device is designed for applications in high-performance computing, data center acceleration, and advanced networking infrastructure.
Additional Information
Series: AGFB006RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 37.5000 |
| Width | 34.0000 |
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1681 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 573480 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1681 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 19440 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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