AGFB006R16A1E3E
573480-Cell, PBGA1681Manufacturer: Intel
Categories: Field Programmable Gate Arrays
Quality Control: Learn More
The Intel AGFB006R16A1E3E is a Field Programmable Gate Array (FPGA SOC) from the AGFB006 series. This component features 573,480 logic cells and an organization of 19,440 CLBs, providing substantial on-chip resources for complex digital designs. It utilizes advanced FINFET technology and operates within a temperature range of 0.0°C to 100.0°C. The device is housed in a 1681-terminal R-PBGA (Rectangular Plastic Ball Grid Array) package with a terminal pitch of 0.920mm. It supports a nominal supply voltage of 0.685V, with a minimum of 0.664V and a maximum of 0.706V. With 384 inputs and 384 outputs, this FPGA is suitable for high-performance applications in sectors such as data processing, telecommunications, and industrial automation. The package dimensions are 37.5000 x 34.0000 mm, with a maximum seated height of 3.6760 mm.
Additional Information
Series: AGFB006RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 34.0000 |
| Technology | FinFET |
| Length | 37.5000 |
| JESD_30_Code | R-PBGA-B1681 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 573480 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1681 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 19440 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
Request a Quote
Clients Also Buy
AGFB006R19A2I2V
573480-Cell
AGFB006R19A3E4F
573480-Cell
AGFB006F89A3E3E
573480-Cell