AGFB006F89A3E3V
573480-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
Quality Control: Learn More
Intel AGFB006F89A3E3V is a high-performance FPGA SoC from the AGFB006 series. This component features 573,480 logic cells and an organization of 19,440 CLBs, providing substantial programmable logic capacity. It offers 384 input and 384 output terminals within an 894-terminal S-PBGA package. The device operates with a nominal supply voltage of 0.685V, ranging from 0.664V to 0.706V, and is built on advanced FINFET technology. Operating within a temperature range of 0.0°C to 100.0°C, this surface-mount component is suitable for demanding applications in areas such as high-performance computing, data center acceleration, and advanced networking infrastructure. The square plastic/epoxy package with bottom-positioned ball terminals ensures reliable interconnectivity.
Additional Information
Series: AGFB006RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | S-PBGA-B894 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 573480 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 894 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 19440 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Square |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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