AGFB004R19A3I3V
392000-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB004R19A3I3V is a high-density Field Programmable Gate Array (FPGA) from the AGFB004 series. This component features 392,000 logic cells and supports 384 input and 384 output connections, facilitating complex digital designs. Utilizing FINFET technology, it operates within a temperature range of -40°C to 100°C. The device is housed in a 1957-terminal R-PBGA package with bottom-mounted ball terminals, designed for surface mounting. Its core operating voltage is nominally 0.685V, with a range of 0.664V to 0.706V, supported by a PLASTIC/EPOXY package body. This FPGA SOC is suitable for demanding applications in telecommunications, data center acceleration, and high-performance computing.
Additional Information
Series: AGFB004RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 392000 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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