AGFB004R19A3I2V
392000-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB004R19A3I2V is a high-performance FPGA SoC from the AGFB004 series, featuring 392,000 logic cells. This device is built on Intel's advanced FINFET technology, offering superior power efficiency and performance. It provides 384 input and 384 output connections, with a total of 1957 terminals in an R-PBGA-B1957 package. The AGFB004R19A3I2V operates within a temperature range of -40.0°C to 100.0°C and supports a nominal supply voltage of 0.685V, with a range from 0.664V to 0.706V. Its rectangular, bottom-terminal ball package is designed for surface mounting. Applications for this component are found in demanding sectors such as high-performance computing, data center acceleration, and advanced networking infrastructure.
Additional Information
Series: AGFB004RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 392000 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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